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Defect oriented testing is expected to play a significant role in coming generations of technology. Smaller feature sizes and larger die sizes will make ICs more sensitive to defects that can not be modeled by traditional fault modeling approaches. Furthermore, with increased level of integration, an IC may contain diverse building blocks. Such blocks include, digital logic, PLAs, volatile and non-volatile memories, and analog interfaces. For such diverse building blocks, traditional fault modeling and test approaches will become increasingly inadequate. Defect oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits (ICs) have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of highest possible quality. Testing, in general and, defect oriented testing, in particular, help in realizing these objectives. Defect Oriented Testing for CMOS Analog and Digital Circuits is the first book to provide a complete overview of the subject. It is essential reading for all design and test professionals as well as researchers and students working in the field. `A strength of this book is its breadth. Types of designs considered include analog and digital circuits, programmable logic arrays, and memories. Having a fault model does not automatically provide a test. Sometimes, design for testability hardware is necessary. Many design for testability ideas, supported by experimental evidence, are included.' ... from the Foreword by Vishwani D. Agrawal
The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.
This is a new type of edited volume in the Frontiers in Electronic Testing book series devoted to recent advances in electronic circuits testing. The book is a comprehensive elaboration on important topics which capture major research and development efforts today. "Hot" topics of current interest to test technology community have been selected, and the authors are key contributors in the corresponding topics.
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
This book will introduce new techniques for detecting and diagnosing small-delay defects in integrated circuits. Although this sort of timing defect is commonly found in integrated circuits manufactured with nanometer technology, this will be the first book to introduce effective and scalable methodologies for screening and diagnosing small-delay defects, including important parameters such as process variations, crosstalk, and power supply noise.
Hurst, an editor at the Microelectronics Journal, analyzes common problems that electronics engineers and circuit designers encounter while testing integrated circuits and the systems in which they are used, and explains a variety of solutions available for overcoming them in both digital and mixed circuits. Among his topics are faults in digital circuits, generating a digital test pattern, signatures and self-tests, structured design for testability, testing structured digital circuits and microprocessors, and financial aspects of testing. The self- contained reference is also suitable as a textbook in a formal course on the subject. Annotation copyrighted by Book News, Inc., Portland, OR
Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.
The proceeding is a collection of research papers presented, at the 9th International Conference on Robotics, Vision, Signal Processing & Power Applications (ROVISP 2016), by researchers, scientists, engineers, academicians as well as industrial professionals from all around the globe to present their research results and development activities for oral or poster presentations. The topics of interest are as follows but are not limited to: • Robotics, Control, Mechatronics and Automation • Vision, Image, and Signal Processing • Artificial Intelligence and Computer Applications • Electronic Design and Applications • Telecommunication Systems and Applications • Power System and Industrial Applications • Engineering Education
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."