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Plasma Source Ion Implantation research at Los Alamos Laboratory includes direct investigation of the plasma and materials science involved in target surface modification, numerical simulations of the implantation process, and supporting hardware engineering. Target materials of Al, Cr, Cu-Zn, Mg, Ni, Si, Ti, W, and various Fe alloys have been processed using plasmas produced from Ar, NH3, N2, CH4, and C2H2 gases. Individual targets with surface areas as large as (approximately)4 m2, or weighing up to 1200 kg, have been treated in the large LANL facility. In collaboration with General Motors and the University of Wisconsin, a process has been developed for application of hard, low friction, diamond-like-carbon layers on assemblies of automotive pistons. Numerical simulations have been performed using a 21/2-D particle- in-cell code, which yields time-dependent implantation energy, dose, and angle of arrival for ions at the target surface for realistic geometries. Plasma source development activities include the investigation of pulsed, inductively coupled sources capable of generating highly dissociated N with ion densities n{sub i} (approximately) 1011/cm3, at (approximately)100 W average input power. Cathodic arc sources have also been used to produce filtered metallic and C plasmas for implantation and deposition either in vacuum, or in conjunction with a background gas for production of highly adherent ceramic coatings.
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
We have performed in situ measurements in two low frequency CFAs to study several basic physics issues which may lead to CFA noise reduction. Our measurements include the local radio-frequency (RF) fields, electron density profiles, electron energy distributions and noise spectrums in both the linear CFA and the reentrant CFA. Comprehensive electron density measurements of the interaction region as well as parametric comparisons such as gain versus sole voltage, beam current and frequency have been used to benchmark two computer simulation codes, MASK and NESSP.
The aim of these proceedings is to present and stimulate discussion on the many subjects related to ion implantation among a broad mix of specialists from areas as diverse as materials science, device production and advanced ion implanters. The contents open with a paper on the future developments of the microelectronics industry in Europe within the framework of the global competition. The subsequent invited and oral presentations cover in detail the following areas: trends in processing and devices, ion-solid interaction, materials science issues, advanced implanter systms, process control and yield, future trends and applications.
In spite of its high cost and technical importance, plasma equipment is still largely designed empirically, with little help from computer simulation. Plasma process control is rudimentary. Optimization of plasma reactor operation, including adjustments to deal with increasingly stringent controls on plant emissions, is performed predominantly by trial and error. There is now a strong and growing economic incentive to improve on the traditional methods of plasma reactor and process design, optimization, and control. An obvious strategy for both chip manufacturers and plasma equipment suppliers is to employ large-scale modeling and simulation. The major roadblock to further development of this promising strategy is the lack of a database for the many physical and chemical processes that occur in the plasma. The data that are currently available are often scattered throughout the scientific literature, and assessments of their reliability are usually unavailable. "Database Needs for Modeling and Simulation of Plasma Processing" identifies strategies to add data to the existing database, to improve access to the database, and to assess the reliability of the available data. In addition to identifying the most important needs, this report assesses the experimental and theoretical/computational techniques that can be used, or must be developed, in order to begin to satisfy these needs.
The specific plans consist of the following activities: optimize conditions for elevated temperature PSII-IBED of nitride coatings of Ti, Cr, Nb, V, and Zr on test flats to establish the effectiveness of PSII in performing ion beam enhanced deposition; characterize coatings thus developed using test procedures for evaluating the wear, friction, corrosion, and rolling contract fatigue behavior; demonstrate the capability of elevated temperature PSII-IBED on a prototype component, and evaluate its performance; modify and refine our existing Monte Carlo code (TAMIX, developed here) for simulating the elevated-temperature PSII-IBED process and benchmark the code to ensure its predictive capability; and develop a detailed plasma simulation model of PSII to generate realistic ion current and energy distributions of ions to the target (to be used as input to the TAMIX code). (JHD).