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LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
This volume provides a discussion of the challenges and perspectives of electromagnetics and network theory and their microwave applications in all aspects. It collects the most interesting contribution of the symposium dedicated to Professor Peter Russer held in October 2009 in Munich.
This textbook has been written by a practicing professional electronics design engineer for the following specific groups: 1. Final year students in electronic engineering and related subjects. 2. Final year physics students taking an electronics option. 3. Junior design engineers who seek rapid career progression. 4. Mature digital designers who seek a broader skill set, to include real-world interfaces, measurements and other analog skills.
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
The present volume and its companion Volume 2 document the proceedings of the Symposium on Surface Contamination: Its Genesis, Detection and Control held in Washington, D.C., September 10-13, 1978. This Symposium was a part of the 4th International Symposium on Contamination Control held under the auspices of the International Committee of Contamination Control Societies, and the Institute of Environmental Sciences (U.S.A.) was the official host. The ubiquitous nature of surface contamination causes concern to everyone dealing with surfaces, and the world of surfaces is wide and open-ended. The technological areas where surface clean ing is of cardinal importance are too many and very diversified. To people working in areas such as adhesion, composites, adsorp tion, friction, lubrication, soldering,device fabrication, printed circuit boards, etc., surface contamination has always been a bete noire. In short, people dealing with surfaces are afflicted with molysmophobiat, and rightfully so. In the past, the subject of surface contamination had been discussed in various meetings, but this symposium was hailed as the most comprehensive symposium ever held on this important topic, as the technical program comprised 70 papers by more than 100 authors from 10 countries. The symposium was truly international in scope and spirits and was very well attended. The attendees represented a broad spectrum of backgrounds, interests, and pro fessional affiliations, but all had a common interest and concern about surface contamination and cleaning.
This book addresses two critical problems that plague materials that make up components in both desalination and cooling water systems: corrosion, and fouling. The book addresses various types and components of industrial desalination technologies with solutions for controlling corrosion, scaling and biofouling. Issues unique to desalination systems, vital for the production of clean water, are considered as well. Green technologies are discussed throughout, along with environmental and economic considerations. The book presents solutions to the problems encountered by internal and external parts of these systems and will aid professionals that design, operate, and maintain them. It will be valuable to professionals in the materials, corrosion, electrochemical and wastewater industries, as well as chemical engineers. Addresses the corrosion issues facing the conventional and modern water desalination systems; Discusses the causes and remediation of problems caused by corrosion, scaling, and biofouling in water treatment; Offers green solutions, thereby minimizing environmental impact while increasing control and productivity of water systems; Suitable for professionals working with water desalination plants, materials scientists and corrosion engineers.
A fully updated version of the popular Introduction to Tribology, the second edition of this leading tribology text introduces the major developments in the understanding and interpretation of friction, wear and lubrication. Considerations of friction and wear have been fully revised to include recent analysis and data work, and friction mechanisms have been reappraised in light of current developments. In this edition, the breakthroughs in tribology at the nano- and micro- level as well as recent developments in nanotechnology and magnetic storage technologies are introduced. A new chapter on the emerging field of green tribology and biomimetics is included. Introduces the topic of tribology from a mechanical engineering, mechanics and materials science points of view Newly updated chapter covers both the underlying theory and the current applications of tribology to industry Updated write-up on nanotribology and nanotechnology and introduction of a new chapter on green tribology and biomimetics