Download Free Colloidal Properties Of Alumina Abrasives For Copper Chemical Mechanical Planarization Book in PDF and EPUB Free Download. You can read online Colloidal Properties Of Alumina Abrasives For Copper Chemical Mechanical Planarization and write the review.

Chemical mechanical planarization (CMP) is used in integrated circuit manufacturing to remove excess material and provide a globally planarized wafer surface. The CMP process requires slurry containing nanometer-sized abrasive particles and chemical additives which produce a mechanical and chemical synergistic effect that is responsible for the material removal rate (MRR). Because copper has become the interconnect material of choice, the focus of our research is on copper CMP. The chemical additives in the slurries control the state of the copper (CuO, Cu2, etc.) on the surface of the wafer and in the slurry and also affect the dispersion characteristics of the abrasives. This research investigated the influence of common additives (glycine, H2O2, etc.), solution pH, and presence of copper on the colloidal behavior of alumina suspensions. The colloidal behavior was characterized through measurement of zeta potential and agglomerate size distributions. The effects of common slurry additives and solution pH on the nanohardness and etch rate of the copper surface were also studied. It was found that with the addition of copper into the slurry, an increase or decrease in agglomeration of the alumina was observed depending on the state of the copper in the solution. With the addition of chemical additives and changes in the pH of the solution, the nanohardness of the copper film was observed to range from 0.05 - 20 GPa, due to the formation of different films (CuO, Cu2O, etc.) and/or changes in the compactness of the surface film from complexing reactions or dissolution. Additionally, experimental results were incorporated into a model of CMP to predict MRR and predictions were compared to experimental copper CMP data. The CMP model accounts for the chemical activity of the slurries through the abrasive size and distribution, hardness and chemical etch rate parameters. The model MRR predictions only agreed with experiment for slurries with pH>8 and small etch rates. However, for acidic slurries and slurries with large etch rates, model predictions did not agree with experiment, most likely due to using nanohardness measured under quiescent conditions.
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
A practical reference for all plastics engineers who are seeking to answer a question, solve a problem, reduce a cost, improve a design or fabrication process, or even venture into a new market. Applied Plastics Engineering Handbook covers both polymer basics - helpful to bring readers quickly up to speed if they are not familiar with a particular area of plastics processing - and recent developments - enabling practitioners to discover which options best fit their requirements. Each chapter is an authoritative source of practical advice for engineers, providing authoritative guidance from experts that will lead to cost savings and process improvements. Throughout the book, the focus is on the engineering aspects of producing and using plastics. The properties of plastics are explained along with techniques for testing, measuring, enhancing and analyzing them. Practical introductions to both core topics and new developments make this work equally valuable for newly qualified plastics engineers seeking the practical rules-of-thumb they don't teach you in school, and experienced practitioners evaluating new technologies or getting up to speed on a new field The depth and detail of the coverage of new developments enables engineers and managers to gain knowledge of, and evaluate, new technologies and materials in key growth areas such as biomaterials and nanotechnology This highly practical handbook is set apart from other references in the field, being written by engineers for an audience of engineers and providing a wealth of real-world examples, best practice guidance and rules-of-thumb
The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.