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This issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.
This issue of ECS Transactions includes papers presented during the 11th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing held during the ECS Fall Meeting in Vienna, Austria, October 4-9, 2009.
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. - Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits - Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
In this series Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. The expert contributions in this volume cover important fundamental aspects of surface contamination that are key to understanding the behavior of specific types of contaminants. This understanding is essential to develop preventative and mitigation methods for contamination control. The coverage complements the treatment of surface contamination in vol.1, Fundamental and Applied Aspects. This volume covers: Sources and Generation of Particles; Manipulation Techniques for Particles on Surfaces; Particle Deposition and Rebound; Particle Behavior in Liquid Systems; Biological and Metallic Contamination; and includes a comprehensive list of current standards and resources. - Comprehensive coverage of innovations in surface contamination and cleaning - Written by established experts in the contamination and cleaning field - Each chapter is a comprehensive review of the state of the art - Case studies included
Ion implantation presents a continuously evolving technology. While the benefits of ion implantation are well recognized for many commercial endeavors, there have been recent developments in this field. Improvements in equipment, understanding of beam-solid interactions, applications to new materials, improved characterization techniques, and more recent developments to use implantation for nanostructure formation point to new directions for ion implantation and are presented in this book.
Master fundamental technologies for modern semiconductor integrated circuits with this definitive textbook, for students from a range of STEM backgrounds, with a focus on big-picture thinking and industry-grade simulation. Includes over 450 full-color figures and over 280 homework problems, with solutions and lecture slides for instructors.
PHOTOVOLTAIC MANUFACTURING This book covers the state-of-the-art and the fundamentals of silicon wafer solar cells manufacturing, written by world-class researchers and experts in the field. High quality and economic photovoltaic manufacturing is central to realizing reliable photovoltaic power supplies at reasonable cost. While photovoltaic silicon wafer manufacturing is at a mature, industrial and mass production stage, knowing and applying the fundamentals in solar manufacturing is essential to anyone working in this field. This is the first book on photovoltaic wet processing for silicon wafers, both mono- and multi-crystalline. The comprehensive book provides information for process, equipment, and device engineers and researchers in the solar manufacturing field. The authors of the chapters are world-class researchers and experts in their field of endeavor. The fundamentals of wet processing chemistry are introduced, covering etching, texturing, cleaning and metrology. New developments, innovative approaches, as well as current challenges are presented. Benefits of reading the book include: The book includes a detailed discussion of the important new development of black silicon, which is considered to have started a new wave in photovoltaics and become the new standard while substantially lowering the cost. Photovoltaics are central to any country’s “New Green Deal” and this book shows how to manufacture competitively. The book’s central goal is to show photovoltaic manufacturing can be done with enhanced quality and lowering costs. Audience Engineers, chemists, physicists, process technologists, in both academia and industry, that work with photovoltaics and their manufacture.