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The method of CVD (chemical vapor deposition) is a versatile technique to fabricate high-quality thin films and structured surfaces in the nanometer regime from the vapor phase. Already widely used for the deposition of inorganic materials in the semiconductor industry, CVD has become the method of choice in many applications to process polymers as well. This highly scalable technique allows for synthesizing high-purity, defect-free films and for systematically tuning their chemical, mechanical and physical properties. In addition, vapor phase processing is critical for the deposition of insoluble materials including fluoropolymers, electrically conductive polymers, and highly crosslinked organic networks. Furthermore, CVD enables the coating of substrates which would otherwise dissolve or swell upon exposure to solvents. The scope of the book encompasses CVD polymerization processes which directly translate the chemical mechanisms of traditional polymer synthesis and organic synthesis in homogeneous liquids into heterogeneous processes for the modification of solid surfaces. The book is structured into four parts, complemented by an introductory overview of the diverse process strategies for CVD of polymeric materials. The first part on the fundamentals of CVD polymers is followed by a detailed coverage of the materials chemistry of CVD polymers, including the main synthesis mechanisms and the resultant classes of materials. The third part focuses on the applications of these materials such as membrane modification and device fabrication. The final part discusses the potential for scale-up and commercialization of CVD polymers.
Chemical Vapor Deposition Polymerization - The Growth and Properties of Parylene Thin Films is intended to be valuable to both users and researchers of parylene thin films. It should be particularly useful for those setting up and characterizing their first research deposition system. It provides a good picture of the deposition process and equipment, as well as information on system-to-system variations that is important to consider when designing a deposition system or making modifications to an existing one. Also included are methods to characterizae a deposition system's pumping properties as well as monitor the deposition process via mass spectrometry. There are many references that will lead the reader to further information on the topic being discussed. This text should serve as a useful reference source and handbook for scientists and engineers interested in depositing high quality parylene thin films.
This book offers a timely and complete overview on chemical vapour deposition (CVD) and its variants for the processing of nanoparticles, nanowires, nanotubes, nanocomposite coatings, thin and thick films, and composites. Chapters discuss key aspects, from processing, material structure and properties to practical use, cost considerations, versatility, and sustainability. The author presents a comprehensive overview of CVD and its potential in producing high performance, cost-effective nanomaterials and thin and thick films. Features Provides an up-to-date introduction to CVD technology for the fabrication of nanomaterials, nanostructured films, and composite coatings Discusses processing, structure, functionalization, properties, and use in clean energy, engineering, and biomedical grand challenges Covers thin and thick films and composites Compares CVD with other processing techniques in terms of structure/properties, cost, versatility, and sustainability Kwang-Leong Choy is the Director of the UCL Centre for Materials Discovery and Professor of Materials Discovery in the Institute for Materials Discovery at the University College London. She earned her D.Phil. from the University of Oxford, and is the recipient of numerous honors including the Hetherington Prize, Oxford Metallurgical Society Award, and Grunfeld Medal and Prize from the Institute of Materials (UK). She is an elected fellow of the Institute of Materials, Minerals and Mining, and the Royal Society of Chemistry.
The new millennium has brought fourth many technological innovations made possible by the advancement of high speed integrated circuits. The materials and energy requirements for a microchip is orders of magnitude higher than that of "traditional" goods, and current materials management requirements for EHS friendly low-k processing require a 10% annual increase in raw materials utilization. Initiated Chemical Vapor Deposition (iCVD) is a low-energy, one step, solvent-free process for producing polymeric thin films This thesis describes the deposition of a novel low-k iCVD precursor, 1,3,5,7-tetravinyltetramethylcylcotetrasiloxane (V4D4). The high degree of organic content in the as-deposited film affords the ability to tune the film's properties by annealing. The incorporation of atmospheric oxygen at high temperatures enhances the mechanical and electrical properties of the films. Films annealed at 410'C have a dielectric constant of 2.15, hardness and modulus of 0.78 GPa and 5.4 GPa, respectively. These values are comparatively better than previously reported results for CVD low-k films. Environmentally friendly low-k processing encompasses materials and energy management in the entire integration process, including lithography. Colloidal lithography was combined with iCVD and capillary force lithography to create spatially addressable grafted polymer pattern nanostructures, without the need for expensive lithography tools. Using this method, we pattern our novel low dielectric constant polymer down to 25 nm without the need for environmentally harmful solvents. Furthermore, these grafted patterns were produced for a broad material set of functional organic, fluorinated, and silicon containing polymers. A variation of this process created amine functionalized biocompatible conducting polymer nanostructure patterns for biosensor applications. These were fabricated using grafting reactions between oxidative chemical vapor deposition (oCVD) PEDOT conducting polymers and amine functionalized polystyrene (PS) colloidal templates. Carboxylate containing oCVD copolymer patterns were used to immobilized fluorescent dyes. Fluorescent colloidal particles were assembled within dyed PEDOT-co-TAA copolymer nanobowl templates to create bifunctional patterns for optical data storage applications. Finally, UV and e-beam lithography were used to pattern covalently tethered vinyl monolayers for resist-free patterning of iCVD and oCVD polymers, using environmentally innocuous solvents.
Difficulties with traditional methods of synthesis and film formation for conducting polymers, many of which are insoluble, motivate the development of CVD methods. Indeed, conjugated polymers with rigid linear backbones typically crystallize readily and overcoming the resultant heat of crystallization makes them difficult to dissolve. Poly(3,4-ethylenedioxythiophene) (PEDOT) thin films were obtained through oxidative chemical vapor deposition (oCVD) by using a new oxidant- bromine. The use of bromine eliminates any post processing rinsing step required with other oxidants like iron chloride and hence makes the process completely dry. Accelerated aging experiments show longer retention of electrical conductivity for the PEDOT films obtained using bromine as the oxidant. Conductivities as high as 380 S/cm were obtained for PEDOT films deposited using bromine as the oxidant at 80 'C, which is significantly higher than that for PEDOT films deposited using iron chloride as the oxidant at the same temperature. Cross-sectional SEM of the PEDOT films deposited using bromine on silicon trench wafers demonstrates high conformal deposition of the films. All the results show the possibility of depositing highly conducting, conformal PEDOT films on any substrate including silicon, glass, paper, plastic. One of the many applications of conducting polymer is as hole-transport layer in light emitting diode. To be competitive in the LED market, improvements in hybrid-LED quantum efficiencies as well as demonstrations of long-lived HLED structures are necessary. In this work, we consider improvement in the stability of the HLED. The device fabricated can be configured as ITO/ Poly (EDOT-co-TAA)/CdSe (ZnS)/ Au. All the materials used in the device synthesis are stable in ambient conditions and all the synthesis steps on ITO substrate are done either in air or in very moderate pressure conditions. This significantly reduces the cost of the device fabrication by obviating the need of packaging layers and ultrahigh vacuum tools. The operating voltage as low as 4.3 V have been obtained for red-LEDs. We believe that with optimization of various layers in the device, further improvements can be made. For green LEDs we obtained the characteristic IV curve of a diode, but we still need to work on getting a functioning green LED.
This wide-ranging volume covers recent developments in the theoretical understanding of the chemistry and physics of chemical vapour deposition (CVD). Contributors are drawn from both academia and industry to achieve a balaced coverage of the subject. The volume emphasizes principles and understanding rather than details of specific materials or processes. Specific examples are given to illustrate the principles.
Handbook of Chemical Vapor Deposition: Principles, Technology and Applications provides information pertinent to the fundamental aspects of chemical vapor deposition. This book discusses the applications of chemical vapor deposition, which is a relatively flexible technology that can accommodate many variations. Organized into 12 chapters, this book begins with an overview of the theoretical examination of the chemical vapor deposition process. This text then describes the major chemical reactions and reviews the chemical vapor deposition systems and equipment used in research and production. Other chapters consider the materials deposited by chemical vapor deposition. This book discusses as well the potential applications of chemical vapor deposition in semiconductors and electronics. The final chapter deals with ion implantation as a major process in the fabrication of semiconductors. This book is a valuable resource for scientists, engineers, and students. Production and marketing managers and suppliers of equipment, materials, and services will also find this book useful.
In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user's group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the principles of CVD at a fundamental level while uniting them with the needs of the microelectronics industry.