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This guide was prepared to assist field foresters in the use of stress wave timing instruments to locate and define areas of decay in standingtimber. The first three sections provide background information, the principles of stress wave nondestructive testing, and measurement techniques for stress‍?wave nondestructive testing. The last section is a detailed description of how to apply stress wave nondestructive testing methods to standing timber. A sample field data acquisition form is included.
Stress-wave nondestructive evaluation (NDE) techniques are used widely in the forest products industry--from the grading of wood veneer to inspection of timber structures. Inspection professionals frequently use stress-wave NDE techniques to locate internal voids and decayed or deteriorated areas in large timbers. Although these techniques have proven useful, little information exists concerning the relationship between stress-wave parameters and deterioration observed as a consequence of marine borer attack. In this pilot test, we examined the relationship between stress-wave transmission time and the quality of wood in Sitka spruce and western hemlock logs that had varying degrees of deterioration as a consequence of attack from marine borers. Stress-wave transmission time, perpendicular to grain, was measured at several locations on each log. The logs were then sawn into lumber, which was then visually evaluated. A relationship was observed between stress-wave transmission time and deterioration of the logs and the yield of lumber from the logs.
This book was proposed and organized as a means to present recent developments in the field of nondestructive testing of materials in civil engineering. For this reason, the articles highlighted in this editorial relate to different aspects of nondestructive testing of different materials in civil engineering—from building materials to building structures. The current trend in the development of nondestructive testing of materials in civil engineering is mainly concerned with the detection of flaws and defects in concrete elements and structures, and acoustic methods predominate in this field. As in medicine, the trend is towards designing test equipment that allows one to obtain a picture of the inside of the tested element and materials. From this point of view, interesting results with significance for building practices have been obtained
The book presents recent advances regarding the inspection and monitoring of engineering structures; including bridges, buildings, aircraft and space structures, nuclear reactors and defense platforms. Among the techniques covered are UAV photogrammetry, strain monitoring, infrared detection, acoustic emission testing, residual stress measurements, fiber optical sensing, thermographic inspection, vibration analysis, piezoelectric sensing and ultrasonic testing. Keywords: Bridges, Buildings, Aircraft Structures, Space Structures, Nuclear Reactors, Defense Platforms, UAV Photogrammetry, Strain Monitoring, Infrared Detection, Acoustic Emission Testing, Residual Stress Measurements, Fiber Optical Sensing, Thermographic Inspection, Vibration Analysis, Piezoelectric Sensing, Ultrasonic Testing, Impact Damage, Anaerobic Reactor Performance, Geomembranes, Ossointegrated Implants, Fatigue Crack Growth, Accelerometer, Nonlinear Cable Bracing, Timber Utility Poles, Steel Pipes, Loosened Bolts on Pipes, IMU-based Motion Capture, CFRP Composites, Maglev Guideway Girder, Cable-Pylon Anchorage, Deep Learning Techniques.
With success of ICEEE 2010 in Wuhan, China, and December 4 to 5, 2010, the second International Conference of Electrical and Electronics Engineering (ICEEE 2011) will be held in Macau, China, and December 1 to 2, 2011. ICEEE is an annual conference to call together researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Electrical and Electronics Engineering along with Computer Science and Technology, Communication Technology, Artificial Intelligence, Information Technology, etc. This year ICEEE is sponsored by International Industrial Electronics Center, Hong Kong. And based on the deserved reputation, more than 750 papers have been submitted to ICEEE 2011, from which about 94 high quality original papers have been selected for the conference presentation and inclusion in the “Advanced Computer, Communication, and Control” book based on the referees’ comments from peer-refereed. All the papers will be published by Lecture Notes in Electrical Engineering (ISSN: 1876-1100), and will be included in Springer Link. We expect that the Advanced Computer, Communication, and Control book will be a trigger for further related research and technology improvements in the importance subject including Signal Processing, Retrieval and Multimedia, Artificial Intelligence, Computing and Intelligent Systems, Machine Learning, Biometric and Biomedical Applications, Neural Networks, Knowledge Discovery and Data Mining, Knowledge-based Systems, Control Systems, Modeling and Simulation Techniques, Wireless Communications, Advances in Wireless Video, etc.