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Held in Guam in November of 2002, the symposium on the test technologies and research issues related to silicon chip production, resulted in the 74 papers presented here. The papers are organized into sections related to the symposium sessions on test generation, on-line testing, analog and mixed si
The Asian Test Symposium provides an international forum for engineers and researchers from all countries of the World, especially from Asia, to present and discuss various aspects of system, board and device testing with design, manufacturing and field considerations in mind. ATS 2003's papers shares state-of-the-art ideas and technologies in testing.
SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. It gives an introduction to testing, describes the problems related to SOC testing, discusses the modeling granularity and the implementation into EDA (electronic design automation) tools. The book is divided into three sections: i) test concepts, ii) SOC design for test, and iii) SOC test applications. The first part covers an introduction into test problems including faults, fault types, design-flow, design-for-test techniques such as scan-testing and Boundary Scan. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling. Finally, the third part focuses on SOC applications, such as integrated test scheduling and TAM design, defect-oriented scheduling, and integrating test design with the core selection process.
​This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
The book is a collection of best papers presented in International Conference on Intelligent Computing and Applications (ICICA 2016) organized by Department of Computer Engineering, D.Y. Patil College of Engineering, Pune, India during 20-22 December 2016. The book presents original work, information, techniques and applications in the field of computational intelligence, power and computing technology. This volume also talks about image language processing, computer vision and pattern recognition, machine learning, data mining and computational life sciences, management of data including Big Data and analytics, distributed and mobile systems including grid and cloud infrastructure.
Includes bibliographical references and index.