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This book provides readers with a single-source reference to the state-of-the-art in analog and mixed-signal circuit design in nanoscale CMOS. Renowned authors from academia describe creative circuit solutions and techniques, in state-of-the-art designs, enabling readers to deal with today’s technology demands for high integration levels with a strong miniaturization capability.
This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes. Key benefits of high-/mixed-voltage RF and analog CMOS circuits are explained, state-of-the-art examples are studied, and circuit solutions before and after voltage-conscious design are compared. Three real design examples are included, which demonstrate the feasibility of high-/mixed-voltage circuit techniques. Provides a valuable summary and real case studies of the state-of-the-art in high-/mixed-voltage circuits and systems; Includes novel high-/mixed-voltage analog and RF circuit techniques – from concept to practice; Describes the first high-voltage-enabled mobile-TVRF front-end in 90nm CMOS and the first mixed-voltage full-band mobile-TV Receiver in 65nm CMOS; Demonstrates the feasibility of high-/mixed-voltage circuit techniques with real design examples.
Reliability concerns and the limitations of process technology can sometimes restrict the innovation process involved in designing nano-scale analog circuits. The success of nano-scale analog circuit design requires repeat experimentation, correct analysis of the device physics, process technology, and adequate use of the knowledge database. Starting with the basics, Nano-Scale CMOS Analog Circuits: Models and CAD Techniques for High-Level Design introduces the essential fundamental concepts for designing analog circuits with optimal performances. This book explains the links between the physics and technology of scaled MOS transistors and the design and simulation of nano-scale analog circuits. It also explores the development of structured computer-aided design (CAD) techniques for architecture-level and circuit-level design of analog circuits. The book outlines the general trends of technology scaling with respect to device geometry, process parameters, and supply voltage. It describes models and optimization techniques, as well as the compact modeling of scaled MOS transistors for VLSI circuit simulation. • Includes two learning-based methods: the artificial neural network (ANN) and the least-squares support vector machine (LS-SVM) method • Provides case studies demonstrating the practical use of these two methods • Explores circuit sizing and specification translation tasks • Introduces the particle swarm optimization technique and provides examples of sizing analog circuits • Discusses the advanced effects of scaled MOS transistors like narrow width effects, and vertical and lateral channel engineering Nano-Scale CMOS Analog Circuits: Models and CAD Techniques for High-Level Design describes the models and CAD techniques, explores the physics of MOS transistors, and considers the design challenges involving statistical variations of process technology parameters and reliability constraints related to circuit design.
Covering both the classical and emerging nanoelectronic technologies being used in mixed-signal design, this book addresses digital, analog, and memory components. Winner of the Association of American Publishers' 2016 PROSE Award in the Textbook/Physical Sciences & Mathematics category. Nanoelectronic Mixed-Signal System Design offers professionals and students a unified perspective on the science, engineering, and technology behind nanoelectronics system design. Written by the director of the NanoSystem Design Laboratory at the University of North Texas, this comprehensive guide provides a large-scale picture of the design and manufacturing aspects of nanoelectronic-based systems. It features dual coverage of mixed-signal circuit and system design, rather than just digital or analog-only. Key topics such as process variations, power dissipation, and security aspects of electronic system design are discussed. Top-down analysis of all stages--from design to manufacturing Coverage of current and developing nanoelectronic technologies--not just nano-CMOS Describes the basics of nanoelectronic technology and the structure of popular electronic systems Reveals the techniques required for design excellence and manufacturability
This book presents high-/mixed-voltage analog and radio frequency (RF) circuit techniques for developing low-cost multistandard wireless receivers in nm-length CMOS processes. Key benefits of high-/mixed-voltage RF and analog CMOS circuits are explained, state-of-the-art examples are studied, and circuit solutions before and after voltage-conscious design are compared. Three real design examples are included, which demonstrate the feasibility of high-/mixed-voltage circuit techniques. Provides a valuable summary and real case studies of the state-of-the-art in high-/mixed-voltage circuits and systems; Includes novel high-/mixed-voltage analog and RF circuit techniques – from concept to practice; Describes the first high-voltage-enabled mobile-TVRF front-end in 90nm CMOS and the first mixed-voltage full-band mobile-TV Receiver in 65nm CMOS; Demonstrates the feasibility of high-/mixed-voltage circuit techniques with real design examples.
Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.
This edition provides an important contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and more. The authors develop design techniques for both long- and short-channel CMOS technologies and then compare the two.
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications.
With the proliferation of wireless networks, there is a need for more compact, low-cost, power efficient transmitters that are capable of supporting the various communication standards, including Bluetooth, WLAN, GSM/EDGE, WCDMA and 4G of 3GPP cellular. This book describes a novel idea of RF digital-to-analog converters (RFDAC) and demonstrates how they can realize all-digital, fully-integrated RF transmitters that support all the current multi-mode and multi-band communication standards. With this book the reader will: - Understand the challenges of realizing a universal CMOS RF transmitter - Recognize the design issues and the advantages and disadvantages related to analog and digital transmitter architectures - Master designing an RF transmitter from system level modeling techniques down to circuit designs and their related layout know-hows - Grasp digital polar and I/Q calibration techniques as well as the digital predistortion approaches - Learn how to generate appropriate digital I/Q baseband signals in order to apply them to the test chip and measure the RF-DAC performance. - Highlights the benefits and implementation challenges of software-defined transmitters using CMOS technology - Includes various types of analog and digital RF transmitter architectures for wireless applications - Presents an all-digital polar RFDAC transmitter architecture and describes in detail its implementation - Presents a new all-digital I/Q RFDAC transmitter architecture and its implementation - Provides comprehensive design techniques from system level to circuit level - Introduces several digital predistortion techniques which can be used in RF transmitters - Describes the entire flow of system modeling, circuit simulation, layout techniques and the measurement process