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This substantially updated and augmented second edition adds over 200 pages of text covering and an array of newer developments in nanoscale thermal transport. In Nano/Microscale Heat Transfer, 2nd edition, Dr. Zhang expands his classroom-proven text to incorporate thermal conductivity spectroscopy, time-domain and frequency-domain thermoreflectance techniques, quantum size effect on specific heat, coherent phonon, minimum thermal conductivity, interface thermal conductance, thermal interface materials, 2D sheet materials and their unique thermal properties, soft materials, first-principles simulation, hyperbolic metamaterials, magnetic polaritons, and new near-field radiation experiments and numerical simulations. Informed by over 12 years use, the author’s research experience, and feedback from teaching faculty, the book has been reorganized in many sections and enriched with more examples and homework problems. Solutions for selected problems are also available to qualified faculty via a password-protected website.• Substantially updates and augments the widely adopted original edition, adding over 200 pages and many new illustrations;• Incorporates student and faculty feedback from a decade of classroom use;• Elucidates concepts explained with many examples and illustrations;• Supports student application of theory with 300 homework problems;• Maximizes reader understanding of micro/nanoscale thermophysical properties and processes and how to apply them to thermal science and engineering;• Features MATLAB codes for working with size and temperature effects on thermal conductivity, specific heat of nanostructures, thin-film optics, RCWA, and near-field radiation.
7.1 Introduction -- 7.2 Rotational Energy Exchange Models -- 7.2.1 Constant Collision Number -- 7.2.2 The Parker Model -- 7.2.3 Variable Probability Exchange Model of Boyd -- 7.2.4 Nonequilibrium Direction Dependent Model -- 7.2.5 Model Results -- 7.3 Vibrational Energy Exchange Models -- 7.3.1 Constant Collision Number -- 7.3.2 The Millikan-White Model -- 7.3.3 Quantized Treatment for Vibration -- 7.3.4 Model Results -- 7.4 Dissociation Chemical Reactions -- 7.4.1 Total Collision Energy Model -- 7.4.2 Redistribution of Energy Following a Dissociation Reaction -- 7.4.3 Vibrationally Favored Dissociation Model -- 7.5 General Chemical Reactions -- 7.5.1 Reaction Rates and Equilibrium Constant -- 7.5.2 Backward Reaction Rates in DSMC -- 7.5.3 Three-Body Recombination Reactions -- 7.5.4 Post-Reaction Energy Redistribution and General Implementation -- 7.5.5 DSMC Solutions for Reacting Flows -- 7.6 Summary -- Appendix A: Generating Particle Properties -- Appendix B: Collisional Quantities -- Appendix C: Determining Post-Collision Velocities -- Appendix D: Macroscopic Properties -- Appendix E: Common Integrals -- References -- Index
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
In the aviation field there is great interest in high-speed vehicle design. Hypersonic vehicles represent the next frontier of passenger transportation to and from space. However, several design issues must be addressed, including vehicle aerodynamics and aerothermodynamics, aeroshape design optimization, aerodynamic heating, boundary layer transition, and so on. This book contains valuable contributions focusing on hypervelocity aircraft design. Topics covered include hypersonic aircraft aerodynamic and aerothermodynamic design, especially aeroshape design optimization, computational fluid dynamics, and scramjet propulsion. The book also discusses high-speed flow issues and the challenges to achieving the dream of affordable hypersonic travel. It is hoped that the information contained herein will allow for the development of safe and efficient hypersonic vehicles.
Heat Transfer in Aerospace Applications is the first book to provide an overall description of various heat transfer issues of relevance for aerospace applications. The book contains chapters relating to convection cooling, heat pipes, ablation, heat transfer at high velocity, low pressure and microgravity, aircraft heat exchangers, fuel cells, and cryogenic cooling systems. Chapters specific to low density heat transfer (4) and microgravity heat transfer (9) are newer subjects which have not been previously covered. The book takes a basic engineering approach by including correlations and examples that an engineer needs during the initial phases of vehicle design or to quickly analyze and solve a specific problem. Designed for mechanical, chemical, and aerospace engineers in research institutes, companies, and consulting firms, this book is an invaluable resource for the latest on aerospace heat transfer engineering and research. - Provides an overall description of heat transfer issues of relevance for aerospace applications - Discusses why thermal problems arise and introduces the various heat transfer modes - Helps solve the problem of selecting and calculating the cooling system, the heat exchanger, and heat protection - Features a collection of problems in which the methods presented in the book can be used to solve these problems
Shock wave-boundary-layer interaction (SBLI) is a fundamental phenomenon in gas dynamics that is observed in many practical situations, ranging from transonic aircraft wings to hypersonic vehicles and engines. SBLIs have the potential to pose serious problems in a flowfield; hence they often prove to be a critical - or even design limiting - issue for many aerospace applications. This is the first book devoted solely to a comprehensive, state-of-the-art explanation of this phenomenon. It includes a description of the basic fluid mechanics of SBLIs plus contributions from leading international experts who share their insight into their physics and the impact they have in practical flow situations. This book is for practitioners and graduate students in aerodynamics who wish to familiarize themselves with all aspects of SBLI flows. It is a valuable resource for specialists because it compiles experimental, computational and theoretical knowledge in one place.
A small-scale, instrumented research aircraft was flown to investigate the flight characteristics of inflatable wings. Ground tests measured the static structural characteristics of the wing at different inflation pressures, and these results compared favorably with analytical predictions. A research-quality instrumentation system was assembled, largely from commercial off-the-shelf components, and installed in the aircraft. Initial flight operations were conducted with a conventional rigid wing having the same dimensions as the inflatable wing. Subsequent flights were conducted with the inflatable wing. Research maneuvers were executed to identify the trim, aerodynamic performance, and longitudinal stability and control characteristics of the vehicle in its different wing configurations. For the angle-of-attack range spanned in this flight program.
A fascinating and informative look at state-of-the-art nanotechnology research, worldwide, and its vast commercial potential Nanotechnology Commercialization: Manufacturing Processes and Products presents a detailed look at the state of the art in nanotechnology and explores key issues that must still be addressed in order to successfully commercialize that vital technology. Written by a team of distinguished experts in the field, it covers a range of applications notably: military, space, and commercial transport applications, as well as applications for missiles, aircraft, aerospace, and commercial transport systems. The drive to advance the frontiers of nanotechnology has become a major global initiative with profound economic, military, and environmental implications. Nanotechnology has tremendous commercial and economic implications with a projected $ 1.2 trillion-dollar global market. This book describes current research in the field and details its commercial potential—from work bench to market. Examines the state of the art in nanotechnology and explores key issues surrounding its commercialization Takes a real-world approach, with chapters written from a practical viewpoint, detailing the latest research and considering its potential commercial and defense applications Presents the current research and proposed applications of nanotechnology in such a way as to stimulate further research and development of new applications Written by an all-star team of experts, including pioneer patent-holders and award-winning researchers in nanotechnology The major challenge currently faced by researchers in nanotechnology is successfully transitioning laboratory research into viable commercial products for the 21st century. Written for professionals across an array of research and engineering disciplines, Nanotechnology Commercialization: Manufacturing Processes and Products does much to help them bridge the gap between lab and marketplace.