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This Brief highlights the search for strain gradients and geometrically necessary dislocations as a possible source of strength for two cases of deformation of materials at small scales: nanoindented single crystal copper and uniaxially compressed single crystal submicron gold pillars. When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the "Smaller is Stronger" phenomenon and has been widely observed. studies suggest that plasticity in one case is indeed controlled by the GNDs (strain gradient hardening), whereas in the other, plasticity is not controlled by strain gradients or sub-structure hardening, but rather by dislocation source starvation, wherein smaller volumes are stronger because fewer sources of dislocations are available (dislocation starvation hardening).
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.