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La microélectronique est un monde complexe dans lequel plusieurs sciences comme la physique, l’électronique, l’optique ou la mécanique, contribuent à créer des nano-objets fonctionnels. La chimie est particulièrement impliquée dans de nombreux domaines tels que la synthèse des matériaux, la pureté des fluides, des gaz, des sels, le suivi des réactions chimiques et de leurs équilibres ainsi que la préparation de surfaces optimisées et la gravure sélective de couches spécifiques. Au cours des dernières décennies, la taille des transistors s’est considérablement réduite et la fonctionnalité des circuits électroniques s’est accrue. Cette évolution a conduit à une interpénétration de la chimie et de la microélectronique exposée dans cet ouvrage. Chimie en microélectronique présente les chimies et les séquences utilisées lors des procédés de production de la microélectronique, des nettoyages jusqu’aux gravures des plaquettes de silicium, du rôle et de l’impact de leur niveau de pureté jusqu’aux procédés d’interconnexion des millions de transistors composant un circuit électronique. Afin d’illustrer la convergence avec le domaine de la santé, l’ouvrage expose les nouvelles fonctionnalisations spécifiques, tels que les capteurs biologiques ou les capteurs sur la personne.
Materials science includes those parts of chemistry and physics that deal with the properties of materials. It encompasses four classes of materials, the study of each of which may be considered a separate field: metals; ceramics; polymers and composites. Materials science is often referred to as materials science and engineering because it has many applications. Industrial applications of materials science include processing techniques (casting, rolling, welding, ion implantation, crystal growth, thin-film deposition, sintering, glassblowing, etc.), analytical techniques (electron microscopy, x-ray diffraction, calorimetry, nuclear microscopy (HEFIB) etc.), materials design, and cost/benefit tradeoffs in industrial production of materials. This book presents new and important research in the field including an Expert Commentary on carbon nanotube electronics.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.