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Selected, peer reviewed papers from the Advanced Materials Conference (AMC 2012), December 12-13th, 2012, Langkawi, Malaysia
AMC 2012 is held with the aim of being a platform for reviewing the latest research and technology in the area of Advanced Materials. It also to bring together researchers, scientists, engineers and scholar students to exchange and share their experiences, new ideas and results in all aspects of Advanced Material Research and discuss the practical challenges encountered and the solutions adopted. Latest advances and innovation in the area of advanced material will be discussed. A total of more than 100 scientific papers in various field of Advanced Materials have been received and accepted for presentation in this conference. Temporary description, more details to follow.
This book contains chapters on cutting-edge developments presented at the TMS annual conference of 2012.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
PRICM-8 features the most prominent and largest-scale interactions in advanced materials and processing in the Pacific Rim region. The conference is unique in its intrinsic nature and architecture which crosses many traditional discipline and cultural boundaries. This is a comprehensive collection of papers from the 15 symposia presented at this event.
This book gathers the proceedings of the 7th International Conference and Exhibition on Sustainable Energy and Advanced Materials (ICE-SEAM), held on November 2021, a virtual conference organized in Melaka, Malaysia. It focuses on two relatively broad areas—advanced materials and sustainable energy—and a diverse range of subtopics: Advanced materials and related technologies: liquid crystals, semiconductors, superconductors, optics, lasers, sensors, mesoporous materials, nanomaterials, smart ferrous materials, amorphous materials, crystalline materials, biomaterials, metamaterials, composites, polymers, design, analysis, development, manufacturing, processing and testing for advanced materials. Sustainable energy and related technologies: energy management, storage, conservation, industrial energy efficiency, energy-efficient buildings, energy-efficient traffic systems, energy distribution, energy modeling, hybrid and integrated energy systems, fossil energy, nuclear energy, bioenergy, biogas, biomass geothermal power, non-fossil energies, wind energy, hydropower, solar photovoltaic, fuel cells, electrification, and electrical power systems and controls.
This book of the GeoMEast 2019 proceedings includes a collection of research and practical papers from an international research and technology activities on recent developments in pavement design, modeling and performance, and effects on infrastructure, green energy, technology, and integration. Sustainability is increasingly a key priority in engineering practices. With the aging transportation infrastructure and renewed emphasis on infrastructure renovation by transportation agencies, innovations are urgently needed to develop materials, designs, and practices to ensure the sustainability of transportation infrastructure.
Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.