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The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2018), organised by GVP College of Engineering (A), Andhra Pradesh, India. The respective papers were written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world, and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.
This book provides the most comprehensive and in-depth coverage of the latest circuit design developments in RF CMOS technology. It is a practical and cutting-edge guide, packed with proven circuit techniques and innovative design methodologies for solving challenging problems associated with RF integrated circuits and systems. This invaluable resource features a collection of the finest design practices that may soon drive the system-on-chip revolution. Using this book's state-of-the-art design techniques, one can apply existing technologies in novel ways and to create new circuit designs for the future.
This book discusses design techniques, layout details and measurements of several key analog building blocks that currently limit the performance of 5G and E-Band transceivers implemented in deep-scaled CMOS. The authors present recent developments in low-noise quadrature VCOs and tunable inductor-less frequency dividers. Moreover, the design of low-loss broadband transformer-based filters that realize inter-stage matching, power division/combining and impedance transformation is discussed in great detail. The design and measurements of a low-noise amplifier, a downconverter and a highly-linear power amplifier that leverage the proposed techniques are shown. All the prototypes were realized in advanced nanometer scaled CMOS technologies without RF thick to metal option.
This book examines integrated circuits, systems and transceivers for wireless and mobile communications. It covers the most recent developments in key RF, IF, analogue, mixed-signal components and single-chip transceivers in CMOS technology.
The main objective of ICMAET 2013 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Materials, Architecture, Agriculture Science, Environment Engineering and Engineering Technology. This conference provides opportunities for the delegates to exchange new ideas and experiences face to face, to establish business or research relations and to find global partners for future collaboration. ICMAET 2013 received over 350 submissions which were all reviewed by at least two reviewers. As a result of our highly selective review process about 130 papers have been retained for inclusion in the ICMAET 2013 proceedings, less than 40% of the submitted papers. The program of ICMAET 2013 consists of invited sessions, and technical workshops and discussions covering a wide range of topics. This rich program provides all attendees with the opportunities to meet and interact with one another. We hope your experience is a fruitful and long lasting one. With your support and participation, the conference will continue its success for a long time. The conference is supported by many universities and research institutes. Many professors play an important role in the successful holding of the conference, so we would like to take this opportunity to express our sincere gratitude and highest respects to them. They have worked very hard in reviewing papers and making valuable suggestions for the authors to improve their work. We also would like to express our gratitude to the external reviewers, for providing extra help in the review process, and to the authors for contributing their research result to the conference. Special thanks go to our publisher DEStech Publication
Abstract This chapter lays the foundation for the work presented in latter chapters. The potential of 60 GHz frequency bands for high data rate wireless transfer is discussed and promising applications are enlisted. Furthermore, the challenges related to 60 GHz IC design are presented and the chapter concludes with an outline of the book. Keywords Wireless communication 60 GHz Millimeter wave integrated circuit design Phase-locked loop CMOS Communication technology has revolutionized our way of living over the last century. Since Marconi’s transatlantic wireless experiment in 1901, there has been tremendous growth in wireless communication evolving from spark-gap telegraphy to today’s mobile phones equipped with Internet access and multimedia capabilities. The omnipresence of wireless communication can be observed in widespread use of cellular telephony, short-range communication through wireless local area networks and personal area networks, wireless sensors and many others. The frequency spectrum from 1 to 6 GHz accommodates the vast majority of current wireless standards and applications. Coupled with the availability of low cost radio frequency (RF) components and mature integrated circuit (IC) techn- ogies, rapid expansion and implementation of these systems is witnessed. The downside of this expansion is the resulting scarcity of available bandwidth and allowable transmit powers. In addition, stringent limitations on spectrum and energy emissions have been enforced by regulatory bodies to avoid interference between different wireless systems.
The book addresses the need to investigate new approaches to lower energy requirement in multiple application areas and serves as a guide into emerging circuit technologies. It explores revolutionary device concepts, sensors, and associated circuits and architectures that will greatly extend the practical engineering limits of energy-efficient computation. The book responds to the need to develop disruptive new system architecutres, circuit microarchitectures, and attendant device and interconnect technology aimed at achieving the highest level of computational energy efficiency for general purpose computing systems. Features Discusses unique technologies and material only available in specialized journal and conferences Covers emerging applications areas, such as ultra low power communications, emerging bio-electronics, and operation in extreme environments Explores broad circuit operation, ex. analog, RF, memory, and digital circuits Contains practical applications in the engineering field, as well as graduate studies Written by international experts from both academia and industry