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20th International Symposium on Quality Electronic Design (ISQED 2019) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic Semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality
Quality Electronic Design (QED)’s landscape spans a vast region where territories of many participating disciplines and technologies overlap. This book explores the latest trends in several key topics related to quality electronic design, with emphasis on Hardware Security, Cybersecurity, Machine Learning, and application of Artificial Intelligence (AI). The book includes topics in nonvolatile memories (NVM), Internet of Things (IoT), FPGA, and Neural Networks.
We are delighted to introduce the proceedings of the 13th edition of the 2020 European Alliance for Innovation (EAI) International Conference on Mobile Multimedia Communications (MOBIMEDIA). This conference has brought researchers, developers and practitioners around the world who are leveraging and developing multimedia coding, mobile communications and networking fields. Developing and leveraging multimedia coding, mobile communications and networking fields requires adopting an interdisciplinary approach where multimedia, networking and physical layer issues are addressed jointly. Basic theories, key technologies and Artificial Intelligence for next-generations wireless communications，intelligent technologies for subspace learning and clustering of high-dimensional data, security and safety, communication networks and coding analysis, electromagnetic and media access control, D2D and IoT, multimedia platform and analysis, new energy and smart city, vision and images analysis, systems and applications, case studies and prediction and educational application are research challenges that need to be carefully examined when designing new mobile media architectures. We also need to put a great effort in designing applications that take into account the way the user perceives the overall quality of the provided service. Within this scope, the MOBIMEDIA 2020 was intended to provide a unique international forum for researchers from industry and academia to study new technologies, applications and standards. Original unpublished contributions are solicited that can improve the knowledge and practice in the integrated design of efficient technologies and the relevant provision of advanced mobile multimedia applications.
This book constitutes the proceedings of the 18th International Symposium on Applied Reconfigurable Computing, ARC 2022, held as a virtual event, in September 2022. The 13 full papers presented in this volume were reviewed and selected from 16 submissions. The papers cover a broad spectrum of applications of reconfigurable computing, from driving assistance, data and graph processing acceleration, computer security to the societal relevant topic of supporting early diagnosis of Covid infectious conditions.
This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.
This book presents the proceedings of the 4th International Conference on Electronics and Signal Processing (ICESP 2023), which was held in Macau, China during January 13-15, 2023. The book consists of contributions from various authors from both academia and industry, focusing on a diverse aspect of signal processing and information communication systems. The published papers suggest cutting-edge solutions that contribute to the quest for the future applications and communicating systems. The book is a useful reference to research students, research fellows, and scientists and engineers in the corresponding fields.
This book aims to provide information in the ever-growing field of low-power electronic devices and their applications in portable devices, wireless communication, sensor, and circuit domains. Negative Capacitance Field Effect Transistors: Physics, Design, Modeling and Applications discusses low-power semiconductor technology and addresses state-of-the-art techniques such as negative capacitance field effect transistors and tunnel field effect transistors. The book is split into three parts. The first part discusses the foundations of low-power electronics, including the challenges and demands and concepts such as subthreshold swing. The second part discusses the basic operations of negative capacitance field effect transistors (NCFETs) and tunnel field effect transistors (TFETs). The third part covers industrial applications including cryogenics and biosensors with NC-FET. This book is designed to be a one-stop guide for students and academic researchers, to understand recent trends in the IT industry and semiconductor industry. It will also be of interest to researchers in the field of nanodevices such as NC-FET, FinFET, tunnel FET, and device–circuit codesign.
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.