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This book features high-quality, peer-reviewed papers from the 2021 6th International Conference on Intelligent Transportation Engineering (ICITE 2021), held in Beijing, China, on October 29–31, 2021. Presenting the latest developments and technical solutions in Intelligent Transportation engineering, it covers a variety of topics, such as intelligent transportation, traffic control, road networking, intelligent automobile and vehicle operation & management. The book will be a valuable reference for graduate and postgraduate audiences, researchers and engineers, working in Intelligent Transportation Engineering.
This book investigates in detail the generalized principle of the pattern multiplication (GPPM) and its application to new phased array with high performances. It introduces the generalized element factor (GEF) to small aperture with multi-modes. Based on the GEF, the GPPM can be used to construct the wide-angle scanning array with the dual-port phase mode antenna. Further, a dual-port phase mode SSPPs antenna is proposed to scan in 3D free space. It is extended to two kinds of 1D arrays with 4 elements; both of them perform good 3D scanning with high gain and large range, which will improve future radar design and wireless communication. This book proposes a new method to develop the potentialities of the GPPM and the new phase array. And the readers can study the method or ideas of the GEF, GPPM, even graft the methods to new phase mode antenna and array. It is intended for undergraduate and graduate students who are interested in new phase mode antenna and array technology, researchers investigating high-performance antenna, and antenna design engineers working on phase array applications.
The volume comprises proceedings of the 10th International Conference on Recent Advances in Civil Aviation. The contents focus on air traffic control and management, quality control and reliability improvement of radio equipment and avionics, designing and testing aircraft assemblies and mechanisms, reliability improvement of aircraft management systems, aviation enterprise management, etc. There is also emphasis on the current problems and prospects for development of unmanned aircraft systems. This volume will be beneficial to researchers, practitioners, and policy-makers alike.
This handbook provides comprehensive knowledge on device and system technologies for seamlessly integrated networks of various types of transmission media such as optical fibers and millimeter and THz waves to offer super high-speed data link service everywhere. The seamless integration of the knowledge of radio and optical technologies is needed to construct wired and wireless seamless networks. High-frequency bands such as millimeter-wave and THz-wave bands where super wideband spectra are available can offer high-speed data transmission and high-resolution sensing. However, the expected coverage is limited due to large wave propagation loss. Thus, convergence of radio and optical links is indispensable to construct worldwide networks. The radio and optical technologies share the same physics and are closely related to each other but have been developed independently. Therefore, there is a big gap between these two fields. Bridging the two fields, this handbook is also intended as a common platform to design integrated networks consisting of wireless and wired links. Full coverage of wireless and wired convergence fields ranging from basics of device and transmission media to applications allows the reader to efficiently access all the important references in this single handbook. Further, it also showcases state-of-the-art technology and cases of its use.
This book presents a practical and comprehensive guide to game-changing and state-of-the-art wearable antennas and RF electronics and their applications. Written by leading experts, the book details how to weave clothing into functional antennas and sensors to serve as unobtrusive devices for medical monitoring, athletic performance tracking, body-area network communications, and a host of other applications. You will learn about the latest advances in materials and electronics along with new and unexplored opportunities in functionalizing fabrics for sensing and wireless connectivity; understand materials selection for diverse wearable applications; gain practical insight into the newest class of embroidered e-textiles; and learn how to engineer flexible and wearable sensors. Wearable Antennas and Electronics covers basic approaches for wearable technology and their applications. You will also get an expert preview of promising future directions and paths for research opportunities. This is a must-have resource for anyone working in the growing industry of wearables and body-area devices, including engineers, researchers, faculty, and graduate students.
The book presents the proceedings of the 11th International Conference on Frontiers of Intelligent Computing: Theory and Applications (FICTA 2023), held at Cardiff School of Technologies, Cardiff Metropolitan University, Cardiff, Wales, UK, during April 11–12, 2023. Researchers, scientists, engineers, and practitioners exchange new ideas and experiences in the domain of intelligent computing theories with prospective applications in various engineering disciplines in the book. This book is divided into two volumes. It covers broad areas of information and decision sciences, with papers exploring both the theoretical and practical aspects of data-intensive computing, data mining, evolutionary computation, knowledge management and networks, sensor networks, signal processing, wireless networks, protocols, and architectures. This book is a valuable resource for postgraduate students in various engineering disciplines.
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
This book includes selected peer-reviewed papers presented at the International Conference on Modeling, Simulation and Optimization (CoMSO 2022), organized by National Institute of Technology, Silchar, Assam, India, during December 2123, 2022. The book covers topics of modeling, simulation, and optimization, including computational modeling and simulation, system modeling and simulation, device/VLSI modeling and simulation, control theory and applications, and modeling and simulation of energy systems and optimization. The book disseminates various models of diverse systems and includes solutions of emerging challenges of diverse scientific fields.
The book presents high-quality papers from the Sixth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2022). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence, and sensor network applications. This book includes the contributions of national and international scientists, researchers, and engineers from both academia and the industry. The contents of this book are useful to researchers, professionals, and students alike.