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Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
This book contains 12 chapters with original and innovative research studies in the issues related to the broadly defined creep effect, which concerns not only the area of construction materials but also natural phenomena. The emphasis on the discussion of a new trend of experimental creep testing, which binds the classic creep methods to seek the correlation of parameters obtained in tests, deserves particular attention. This book aims to provide the readers, including, but not limited to, students and doctoral students and also the research personnel and engineers involved in the operation of equipment and structural components as well as specialists in high-temperature creep-resisting materials, with a comprehensive review of new trends in the field of creep-exposed materials and their research methodology. The chapters of this book were developed by respected and well-known researchers from different countries.
This book provides an understanding of the evolution of digitization in our day to day life and how it has become a part of our social system. The obvious challenges faced during this process and how these challenges were overcome have been discussed. The discussions revolve around the solutions to these challenges by leveraging the use of various advanced technologies. The book mainly covers the use of these technologies in variety of areas such as smart cities, healthcare informatics, transportation automation, digital transformation of education. The book intends to be treated as a source to provide the systematic discussion to the bouquet of areas that are essential part of digitized societies. In light of this, the book accommodates theoretical, methodological, well-established, and validated empirical work dealing with various related topics.
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
This book includes the original, peer-reviewed research articles from the International Conference on Computational Intelligence and Computing (ICCIC 2020), held in September 2020 on a virtual platform jointly organized by SR Group of Institutions, Jhansi, India, IETE, Kolkata Centre, India, and Eureka Scientech Research Foundation, Kolkata India. It covers the latest research in image processing, computer vision and pattern recognition, machine learning, data mining, big data and analytics, information security and privacy, wireless and sensor networks and IoT applications, artificial intelligence, expert systems, natural language processing, image processing, computer vision, artificial neural networks, fuzzy logic, evolutionary optimization, rough sets, web intelligence, intelligent agent technology, virtual reality, and visualization.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
This volume offers a wealth of interdisciplinary approaches to artificial intelligence, machine learning and optimization tools, which contribute to the optimization of urban features towards forming smart, sustainable, and livable future cities. Special features include: New research on the design of city elements and smart systems with respect to new technologies and scientific thinking Discussions on the theoretical background that lead to smart cities for the future New technologies and principles of research that can promote ideas of artificial intelligence and machine learning in optimized urban environments The book engages students and researchers in the subjects of artificial intelligence, machine learning, and optimization tools in smart sustainable cities as eminent international experts contribute their research results and thinking in its chapters. Overall, its audience can benefit from a variety of disciplines including, architecture, engineering, physics, mathematics, computer science, and related fields.
The widespread availability of technologies has increased exponentially in recent years. This ubiquity has created more connectivity and seamless integration among technology devices. Emerging Trends and Applications of the Internet of Things is an essential reference publication featuring the latest scholarly research on the surge of connectivity between computing devices in modern society, as well as the benefits and challenges of this. Featuring extensive coverage on a broad range of topics such as cloud computing, spatial cognition, and ultrasonic sensing, this book is ideally designed for researchers, professionals, and academicians seeking current research on upcoming advances in the Internet of Things (IoT).